INNOEVSIC | Attracts Global Customer Interest at Its PCIM Asia Debut

          INNOEVSIC made its first appearance at PCIM Asia on August 26, presenting its SiC modules, MOSFETs and solutions at Booth C22 in Hall 16. UHP, ED3 and FPA were among the highlights on the opening day. Customers and industry partners from China and overseas visited the booth to explore the products and discuss performance, cooling requirements and integration into their systems.

          The SiC module lineup includes UHP, ED3, EB2, FPA, PD2, FPC, APM and SPM, covering a range of voltage ratings, power levels and applications. The portfolio serves automotive and mobility, AI data centers, renewable energy, and industrial and infrastructure applications. For the UHP, ED3 and FPA platforms, improvements to thermal management, parasitic characteristics, current sharing, and interconnection materials and processes increase current-handling capability and package reliability. These refinements help the modules perform reliably in demanding applications involving high power and high switching frequencies.

          Also on display are gate driver boards and UHP and SPM inverter bricks. The driver boards are designed for the fast switching speeds of SiC devices and incorporate short-circuit and undervoltage protection, DC bus voltage and NTC temperature sensing, Miller clamping and soft turn-off. Short-circuit protection responds in less than 3 μs, supporting fast protection and stable operation under high-dv/dt conditions. The UHP inverter brick combines cooling, electrical connections and efficient assembly in a power unit designed for traction drives and other applications requiring higher power output. The SPM version integrates the module with a pin-fin heatsink, using low-inductance connections and coordinated thermal management to improve system performance.

          The products use advanced packaging, interconnection and cooling technologies, including silver sintering, clip interconnects, Si₃N₄/AlN AMB substrates, direct water cooling with pin fins, and three-level topologies. Together, these design choices reduce parasitic inductance and thermal resistance while supporting high power output and reliable operation.

          PCIM Asia 2026 runs from August 26 to 28 at the Shenzhen World Exhibition & Convention Center in Baoan. The INNOEVSIC team welcomes customers and partners to Booth C22 in Hall 16 to discuss their technical and application requirements.