Inside the INNOEVSIC SiC Module Factory

          INNOEVSIC develops and manufactures SiC MOSFET wafers and discrete devices, as well as housed, molded and embedded power modules. The project occupies approximately 230,000 square meters. The module factory is planned to produce 740,000 modules per month and uses more than 40 types of advanced processing and test equipment, with an overall automation rate of 95%.

          The factory was designed to accommodate different package formats, product specifications and customer requirements. Its production processes include heat-assisted die placement, sintering, reflow soldering, epoxy dispensing, molding, assembly, burn-in and inspection. Housed, molded and embedded modules share equipment in the earlier stages of production, while later stages allow quick changeovers between products. This flexibility enables the factory to handle a varied product mix without sacrificing automation.

          Material handling, loading and unloading are automated across the line, reducing manual intervention and keeping work moving consistently between processes. Leading equipment is used at critical stages to maintain control over the many steps that determine the quality and reliability of a finished SiC module.

          Second-generation sintering equipment from a leading supplier accommodates several substrate formats, including 5 × 7-inch DBC and AMB substrates. It supports both copper and silver sintering to form reliable die-to-substrate joints with effective heat transfer and long-term stability.

          Soldering and interconnection equipment can process multiple products on the same line. A precision control system measures solder deposits in real time and automatically adjusts the solder volume to maintain consistent joints.

          Precision molding equipment controls package dimensions, while housing assembly equipment allows rapid product changeovers. Automated inspection and correction of adhesive application help prevent gaps and excess adhesive.

          A new generation of in-house-developed test equipment covers all product platforms and improves testing efficiency by 15% compared with mainstream equipment. Dedicated fixtures accommodate the full product range, with parasitic inductance control among the more advanced capabilities in China. Inspection combines automated AI-based checks, electrical tests and high-precision 2D and 3D measurements. Cameras above and below the product inspect both sides, using conventional, AI and 3D algorithms to improve coverage and defect detection.

          Manufacturing execution and equipment automation systems (MES and EAP) track production from incoming materials to finished-product shipment. Bill of materials data is linked to serial numbers in real time, allowing individual chips, AMB substrates and other key materials to be traced. The systems also associate production records with the machines, molds and fixtures used, and check that the correct process flow is followed. Records and checks covering personnel, equipment, materials, tooling, programs and validation help prevent production errors and support quality investigations and continuous improvement.

          The factory gives INNOEVSIC the means to turn its device and module development work into products that can be consistently manufactured, tested and supplied at scale. The company will continue to improve process stability and product consistency as it serves customers in electric vehicles, renewable energy, industrial and consumer applications, and high-tech sectors.